AUTOMOTIVE
We’re already here.... And there. With the automotive components market moving to Asia, Bi-Link already has the resources in place. TS Certified facilities, Large Tonnage Stamping, Insert/Over-Moulding, value-add services & wireless experience to support the telematics industry…Bi-Link is the single source for a broad range of products from our facilities in North America and Asia
INTERCONNECT
Bi-Link supplies the major interconnect manufacturers globally. Many of these companies, who have in-house stamping resources, leverage our complementary capabilities and interconnect experience. Products and services we provide include: precision metal stamping, insert & precision moulding, hi-speed stamping and the seamless transfer of programs between our global facilities
CONSUMER AND INDUSTRIAL
At Bi-Link, Consumer and Industrial means everything from Printers to Medical Devices to Industrial Controls. Our diverse customer base has common requirements. What you get from Bi-Link is a flexible supplier that can easily meet your specific needs. We support joint R&D efforts, vendor consolidation & program transfers, and emerging market support…even if that means a new Bi-Link facility near your manufacturing site.
WIRELESS
We have been involved at all levels of component design, development and manufacturing since the inception of this industry. Our innovations allow you to lead the industry by pushing the limits of serviceability and form factor constraints. Our un-matched global concurrent engineering support ensures quality and reliability are built into your initial design. When you combine all that with our massive in-house tooling resources, your products will get to market first. From board level components to antennas to enclosures…You’ll see, we know what we’re doing.
MEMS
Our experience in high volume component manufacturing, coupled with our dedication to industry solving industry problems, Bi-Link has the MEMS industry “covered”. Our unique products, short lead times and innovative designs allow for greater flexibility in MEMS die design and assembly. Our industry leading packaging solutions will lower your component costs and improve your operational efficiency.